By Shengqiang Yang, Shichun Yang, Hang Gao
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Extra resources for Surface Finishing Technology and Surface Engineering
Surface Profile and Waviness Analysis. Fig. 4 is the surface profile record of one specimen, which includes the surface roughness and waviness properties (Horizontal direction 100×, Vertical direction 5000×). 4 (a) and (b), demonstrates ECFM process can effectively reduce the surface kurtosis and average maximum profile peak height, which means the surface profile height become mean and those surface local peaks have been smoothed down. It also indicates the surface waviness is improved. Table 3 shows the changes in surface waviness parameters before and after ECFM process.
1(a) and Fig. 1(b) are symmetrical. Because the height of micro-profiles in Fig. 1(a) and Fig. 1(b) is same, the wavelengthes can be expressed by profile wave angle. The wavelength in Fig. 1(a) is smaller than that in Fig. 1(b), which can be expressed as α < β. For the convenience of analysis, it is postulated that the current distribution on the surface micro-profile is under the ideal state. The following assumptions are tenable: 1) Cathode surface is perfectly smooth. 2) Ohm's law is applied in the interelectrode gap, the conductivity of electrolyte in the machining, electrode voltage is constant and current efficiency of anodic dissolution is constant.
Two typical types of workpieces, stainless steel rod and aero-engine blade, were selected to evaluate the validity of ECFM. On the basis of these optimal machining parameters match, ECFM experiments were developed. The surface microscopic properties such as the roughness height and spacing characteristics, the surface waviness characteristics, surface microstructure and spectral reflectance before and after ECFM were compared and analyzed. 03μm and obtain the high surface quality and a smooth surface; (3) can eliminate the surface scratch marks and defects and increase the thermal and mechanical fatigue life of the workpiece.
Surface Finishing Technology and Surface Engineering by Shengqiang Yang, Shichun Yang, Hang Gao